SANTA CLARA, Calif.--(BUSINESS WIRE)--Applied Materials, Inc. today announced the shipment of its 2,500 th CMP 1 system, marking a major milestone in the industry and ten consecutive years of CMP ...
During the chemical mechanical polishing of wafers, the CMP pad is used to store the CMP polishing solution and transport it to the polishing area, so that the polishing continues evenly and the ...
SAN JOSE, Calif., February 3, 2009 — SVTC Technologies (www.svtc.com) today announced a partnership with Entrepix, Inc., (www.entrepix.com) to provide 300 mm chemical mechanical polishing (CMP) ...
According to the annual report of Applied Materials and data from Cabot Microelectronics, the number of CMP process steps required for 14nm logic chips has increased from 10 times for 180nm chips to ...
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