Hysol FP4547FC debuts as the market's first capillary flip-chip underfill to be compatible with clean and no-clean flux residues, thereby facilitating lead-free assemblies. The product promises to ...
YINCAE, a leading innovator in advanced materials solutions, today announced the launch of its groundbreaking underfill material, UF 158UL. This cutting-edge product is designed to meet the increasing ...
DeepMaterial is an industrial adhesive manufacturer providing adhesive and film application materials products and solutions. Shenzhen, China - February 22, 2023 — DeepMaterial, a domestic leader in ...
YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA eliminates cleaning processes, ...
Irvine, CA – Henkel recently announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market's most demanding advanced packages, ...
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