Rohm’s free web-based simulator adds a thermal analysis function for circuit designs where heat is likely to become an issue. The Solution Simulator allows circuit and system designers in both the ...

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

The drive for better efficiency in the power electronics industry has generated enormous gains in the last few years. The design of power semiconductors has improved, silicon carbide (SiC) and gallium ...

Consumer electronics – tablets, smartphones and e-readers – is now leading the industry in growth. For system manufacturers and integrated circuit (IC) suppliers, the challenge involves keeping pace ...

This paper presents a reference design flow for solving the electrical, thermal and mechanical challenges of a printed circuit board (PCB) using simulation tools from ANSYS. This approach can be ...

Printed Circuit Boards (PCBs) are a fundamental part of the majority of electronics systems. They are primarily designed to mechanically support and electrically connect electronic components, and are ...

A study shows how high-thermal dielectrics outperform FR-4 for bulk heat spreading, with surface-mount thermal bridges ...

For the PDF version of this feature, click here. In most modern power semiconductor applications there is a need to carefully manage heat. This is true in fields as diverse as mobile communications, ...

What is thermal clad and what is its role in thermal management on circuit boards? Why does thermal clad use either copper or aluminum in the base layer? Is thermal clad compatible with any circuit ...

This paper presents a reference design flow for solving the electrical, thermal and mechanical challenges of a printed circuit board (PCB) using simulation tools from ANSYS. This approach can be ...