TOKYO, JAPAN: ADEKA Corp. has developed a new single-component type additive for TSV (Through Silicone Via) copper plating that will bring a reduction in costs, prevent defects and is very versatile.

https://doi.org/10.2307/3759190 • https://www.jstor.org/stable/3759190 Copy URL Two fungi were isolated from a plating solution containing 25% (63,612.5 ppm) copper ...

Speaker one In this practical we will be making a soluble salt called copper sulfate which is used to treat fungal diseases, such as foot rot in cattle. Speaker two Yep, something I struggle with ...

Researchers at the University of New South Wales have used a 1 µm copper plating layer on the front silver grid of a TOPCon solar cell to create a protective barrier that reportedly reduces corrosion ...