Why non-destructive SAM is an efficient tool for analysis of adhesion between layers and presence of possible flaws in each layer. Scanning acoustic microscopy, or SAM, is a non-destructive technique ...

The adhesion of dielectric thin films has presented a major obstacle for interconnect integration and dependability. Issues such as film adhesion failures, reduced dielectric film mechanical integrity ...

Illustration of the laser-induced transformation of diamond into planar-oriented graphite, with interfacial thermal stress control, followed by mechanical cleavage into graphene, ultimately achieving ...

Researchers have found that asymmetric stresses within electrodes used in certain wearable electronic devices provides an important clue as to how to improve the durability and lifespan of these ...

Surface modification of medical devices allows manufacturers to maintain the mechanical properties of materials while adding specific functionalities at biological interfaces. This optimization is ...