Toshiba aims to strengthen position as leader in semiconductor innovation, and accelerates development of next-gen power ...
To enhance analogue and mixed-signal verification, Toshiba has adopted Siemens’ Solido Simulation Suite and Solido Design ...
The S-Edit design environment for schematic capture offers an integrated suite of analog and mixed-signal design capture, simulation, layout, design-rule checking, and verification tools. The tool ...
Acquisition enables System-on-a-Chip (SoC) designers to accelerate design closure and enhance functional and structural constraint correctness with industry-proven timing constraints management PLANO, ...
In this white paper, a gallium arsenide (GaAs) pseudomorphic high-electron mobility transistor (pHEMT) power amplifier (PA) design approach is examined from a systems perspective. It highlights the ...
Keysight says its AI-powered assistants for its Advanced Design System (ADS) deliver breakthrough natural language capabilities ...
The Liquid Libraries software integrates standard cell libraries into the mainstream electronic design automation (EDA) flow, enabling design-specific standard cells to be created on-the-fly during ...
Advanced Design System (ADS) 2003A, the newest version of the company's communications EDA software, is said to offer the industry's most complete front-to-back MMIC design flow solution. It provides ...
EDA vendors are taking aim at new ways to improve the productivity of design and verification engineers, who are struggling to keep pace with exponential increases in chip complexity in tight ...
The EDA trio—Cadence Design Systems, Siemens EDA, and Synopsys—is working hands in hand with TSMC to facilitate production-ready EDA tools for the mega-fab’s newest and most advanced processes. These ...
The EDA leader has generated over $500M to date in AI tools and technologies. Now a new data analytics solution applies data management, curation, and analysis across the entire pipeline of chip ...
China-based electronic design automation (EDA) company Empyrean Technology has unveiled on January 12 that it has begun to undertake the research and development of chiplet-based advanced packaging as ...
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