In 2001, IBM patented a method of using a double bump material structure to make a reliable joint between a chip and its package for bump pitch below 150 µm. 1 This invention improved the existing ...

Hardware hacking can be extremely multidisciplinary. If you only know bits and bytes, but not solder and electrons, you’re limited in what you can build. The same is true for mechanical design, where ...

Professor of Mechanics, Washington University, St. Louis, Mo. It's easy to construct finite-element models with errors. And it's just as easy to correct them, when you know how. The first step in a ...

Plastometrex has debuted MultiScale, designed to capture high-resolution mechanical property variation across thin, welded ...

When it comes to FDM 3D prints and making them stronger, most of the focus is on the outer walls and factors like their layer adhesion. However, paying some attention to the often-ignored insides of a ...

Theory of elasticity: elastic stability, principal of minimum potential energy, Raylegh-Ritz methods. Introduction to finite element methods of stress analysis: computer implementation and use of ...

Plastometrex has introduced its new MultiScale capability to help users capture high-resolution mechanical property variation across thin, welded, and complex geometries that are typically ...

What Are FEM, FDM and FVM? FEM, FDM and FVM differ from one another in important ways. Understanding these distinctions is key to selecting the method most appropriate for your purposes. The ...