Fluid flowing around or through a component can cause significant displacement and stress. Understanding and accounting for this fluid-structure interaction (FSI) is often important to the design.
Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...
MOUNTAIN VIEW, Calif., Oct. 26, 2022-- Addressing the stringent performance and power demands of 5G/6G SoCs, Synopsys, Inc. (Nasdaq: SNPS), Ansys (Nasdaq: ANSS) and Keysight Technologies, Inc. (NYSE: ...
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