The M61041FP is an semiconductor IC device developed for smart battery packs. It is ideal for smart battery system (SBS) battery packs that consist of four lithium ion batteries connected in series. A ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Nisshinbo Micro Devices Inc. has deployed multiple Cadence ® solutions, including the AI-based ...

Santa Clara, CA and Kyoto, Japan, Nov. 08, 2023 (GLOBE NEWSWIRE) -- ROHM Semiconductor today introduced the new BD2311NVX-LB gate driver IC, optimized for GaN devices, which achieves gate drive speeds ...

Not so long ago, defense and aerospace applications were the traditional drivers of advances in electronic packaging technologies, or "the way electronic systems are assembled." At the time, cost was ...

3D ICs are an exciting and promising extension of heterogeneous advanced package technology into the third dimension. Although far from mainstream, 3D IC’s time is coming, as chiplet standardization ...

Semiconductors are the essential component fueling the growth of industries such as automotive, renewable energy, communications, information technology, defense, and consumer electronics. The rise of ...

The verification gap emerges not from a lack of computational power but from the multiphysics nature of 3D-IC behavior.

Cambridge GaN Devices (CGD) has developed a 650V GaN IC for automotive applications that manages automakers' desire to improve inverter efficiency. ICeGaN helps designers produce smaller, lighter ...

MEMS are primarily transducer systems that can control or sense chemical, optical, or physical quantities, such as fluids, acceleration, or radiation. A MEMS device/transducer possesses an electrical ...

In 2022, the overall revenue of the global IC design industry reached US$215.4 billion. Among them, the US IC design sector is the largest in scale, with a 63% market share and revenue of over US$130 ...