MUNICH--(BUSINESS WIRE)--Cadence Design Systems, Inc. (NASDAQ: CDNS) today introduced the Cadence ® Legato™ Reliability Solution, the industry’s first software product that meets the challenges of ...

Chip reliability is coming under much tighter scrutiny as IC-driven systems take on increasingly critical and complex roles. So whether it’s a stray alpha particle that flips a memory bit, or some ...

PITTSBURGH, Nov. 16, 2023 /PRNewswire/ -- Ansys (NASDAQ: ANSS) has collaborated with TSMC and Microsoft to validate a joint solution for analyzing mechanical stresses in multi-die 3D-IC systems ...

Experts at the Table: Semiconductor Engineering sat down to talk about silicon lifecycle management, how it’s expanding and changing, and where the problems are, with Prashant Goteti, principal ...

As IC electronics have become more densely packed, cross-talk among them has become a problem As IC electronics have become more densely packed, cross-talk among them has become a problem. One means ...

The move to environmentally sound RoHS-compliant products poses a number of significant challenges to the electronics industry. One of the most important is the move to higher solder process ...

Power Integrations’ 1700 V Switcher IC Delivers Reliability and Space-Saving Benefits in 800 V BEVs Performance of InnoSwitch™3-AQ flyback IC demonstrated in new reference designs featuring ...

Reliability tests are a crucial part of the manufacturing process, one that ensures your product meets the quality standards your customers expect. All the same, designing good reliability tests is ...

The joint solution provides a high-speed and high-capacity cloud solution for analyzing the mechanical stresses in 2.5D/3D-IC multi-die systems, which extends product reliability Ansys Mechanical is ...

Performance of InnoSwitch™3-AQ flyback IC demonstrated in new reference designs featuring wide-creepage package The InnoSwitch3-AQ IC, featuring a 1700 V silicon-carbide (SiC) switch, is an ideal ...