To allow designers the flexibility of interchanging 100 Ohm and 85 Ohm signal modules based on system needs, Molex designed both connector systems to be of the same physical size, density, pitch and ...
At DesignCon 2015, Sanmina (booth #611) announced its begun shipping new backplanes featuring high-speed production vector-network-analysis (VNA) testing. At DesignCon 2015, Sanmina (booth #611) ...
High-speed interconnects may be used to link chips, boards or systems. The distance between target devices is the major difference. Chip-to-chip interconnects normally span less than 20 inches, are ...
The U.S. Navy, always seeking paths to reduce the size, weight, and power (SWaP) of systems, took another step in that direction with the FlexVPX concept, which was developed at its U.S. Naval ...
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