Increasing the yield of wafers is one way to attack the current global chip shortage. One possibility to reduce losses is a laser processing method called wafer stealth dicing. Here, laser power is ...

The MarketWatch News Department was not involved in the creation of this content. Fonon, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material ...

The demand for consistently high electrical performance in the power discrete semiconductor market has driven component developers to continuously enhance semiconductor assembly packaging technology ...

Manufacturing of semiconductor chips involves cutting the wafers, first: The process is known as wafer dicing and produces “chips” or “die”. Typical challenges in wafer dicing applications include ...

ORLANDO, Fla.--(BUSINESS WIRE)--Fonon, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and additive ...

Chicago, Dec. 11, 2025 (GLOBE NEWSWIRE) -- The global wafer dicing services market was valued at US$ 617.5 million in 2025 and is projected to exceed valuation of US$ 932.9 million by 2035 at a CAGR ...

Increased tax credits for chipmakers would further incentivize domestic semiconductor production; CMS Laser is on standby to provide sophisticated silicon processing solutions powered by lasers. Today ...

TOKYO--(BUSINESS WIRE)--Furukawa Electric Co., Ltd. (TOKYO:5801) has begun mass producing expand separation dicing tape, a type of tape for use with semiconductors. Expand separation dicing tape ...

Advances in laser grooving means that manufacturers are able to optimize die separation quality by combining traditional blade dicing and laser grooving techniques to separate individual chips from ...

The report highlighted Disco’s significant milestone in laser saw shipments, noting the company began selling the equipment in 2002, reached 1,000 units in cumulative shipments by 2014, and has since ...