TEMPE, AZ--(Marketwire - Oct 22, 2012) - EPEPS -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced enhancements to its Allegro ® 16.6 ...

Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...

Don't be so stuck in the circuits that you forget the importance of IC packages. Here are a couple cards from the Microchip 2005 product selector: While most design engineers are using surface mount ...

Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...

A number of years ago, the packages of electronic systems were only intended to protect the circuit from mechanical stresses and to realize a simple fan-out from the close spacing of connections on ...

Chip design companies and package assembly houses have no unified signoff verification process to ensure that an IC package meets manufacturability and performance requirements. Packages need a ...

Originally, I started to write this entry about a Sustainable Brand Identity. But as I put pen to paper and fingers to keyboard, I realized that my opening paragraph deserved a bit more attention.