Pack Studio by Inkbit Corp. uses deterministic, data-driven computation to generate optimize layouts for boxes, pallets, and ...

Intel’s embedded multi-die interconnect bridge (EMIB) technology—aiming to address the growing complexity in heterogeneously integrated multi-chip and multi-chip (let) architectures—made waves at this ...

The world we are living in is increasingly becoming software-defined, where artificial intelligence (AI) is adding the next layer of functionality. And it’s driving the need for more compute to enable ...

Wafer-level packaging enables higher form factor and improved performance compared to traditional SoC designs. However, to ensure an acceptable yield and performance, EDA companies, OSAT companies, ...

Advanced packaging is rapidly becoming a mainstream option for chipmakers as the cost of integrating heterogeneous components on a single die continues to rise. Despite several years of buzz around ...

Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...

In the complex ecosystem of global supply chains, packaging is as important as the product itself. Remember, packaging is ...