Image transfer, also known as photolithography (or simply, lithography), plays a crucial role in defining the circuit patterns on a panel. With photolithography, IC substrate manufacturers can ...

LG Innotek has developed a next-generation smart IC (integrated circuit) substrate, a core component in smart cards, that requires no metal plating. The breakthrough ...

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

The global advanced IC substrate market is poised for significant growth, according to recent industry reports. Global Information, Inc. (GII) projects the market to reach US$18.11 billion in 2024 and ...

SEOUL, South Korea, Dec. 22, 2025 /PRNewswire/ -- LG Innotek (CEO Moon Hyuksoo) announced on December 22 that the company has successfully developed a 'Next-Generation Smart IC (integrated circuit) ...

Advanced IC substrates (AICS) have been marching toward the 2µm line/space (L/S) redistribution layer (RDL) technology node for some time (figure 1). However, many questions remain about the ability ...

LG Innotek announced on the 10th that it has successfully developed a ‘next-generation smart IC (integrated circuit) substrate’ that enhances performance while reducing carbon emissions by half ...

The semiconductor is a highly integrated device that cannot be connected directly to the main board in the way that condensers or resistors can. Therefore, a packaging substrate (or intermediary layer ...

Cuts carbon dioxide emissions from its production by 50%—equivalent to planting 1.3 million trees annually. Boosts durability by up to three times for secure information recognition even with ...