OM Group has been providing plating solutions to the electronics industries for over 40 years. Through this experience, the Solar Chemicals division has developed a revolutionary Ni/Cu/Ag plating ...
Advanced packaging can be an alphabet soup of possible approaches, from heterogenous integration of multiple die types into a single package, to three-dimensional stacking of multiple dies on top of ...
Researchers from Pohang University of Science and Technology (POSTECH) and the University of Montpellier have successfully synthesized wafer-scale hexagonal boron nitride (hBN) exhibiting an ...
To allow 32-nm generation high-k metal gate stacks using a single metal, instead of the two different metals required previously for CMOS, semiconductor manufacturing equipment maker ASM America Inc, ...
Architects and front end designers usually leave the back end to the physical designers: they know there can be different numbers of metal layers, but may not realize the characteristics of each metal ...
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