Separating semiconductor chips from a wafer is an important step in the backend of semiconductor manufacturing. The new process from Lidrotec combines ablative laser dicing under a liquid stream with ...
How Does Fonon BlackStar Maximize Wafer Dicing Yield? Fonon Corporation’s laser-powered BlackStar Wafer Dicing System helps semiconductor fabricators eliminate defects, distortions, cracks and ...
ORLANDO, Fla.--(BUSINESS WIRE)--Fonon Corporation, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and ...
The demand for consistently high electrical performance in the power discrete semiconductor market has driven component developers to continuously enhance ...
Manufacturing of semiconductor chips involves cutting the wafers, first: The process is known as wafer dicing and produces “chips” or “die”. Typical challenges in wafer dicing applications include ...
TOKYO--(BUSINESS WIRE)--Furukawa Electric Co., Ltd. (TOKYO:5801) has begun mass producing expand separation dicing tape, a type of tape for use with semiconductors. Expand separation dicing tape ...
In its ongoing push to create smaller, thinner, and denser chip packages, the semiconductor industry has intensified its focus on integrating separately manufactured components with different ...
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