A packaging process developed by Amkor Technology of Chandler, Ariz., is being described by the company as the packaging equivalent of a semiconductor move from 200- to 300-mm wafers. The company's ...

At one time, chip packaging was an afterthought. Chipmakers were more worried about IC design. Packaging was considered a mere commodity, which was simply used to house the design. More recently, ...

Ottawa, Oct. 22, 2024 (GLOBE NEWSWIRE) -- The global semiconductor & IC packaging materials market size is predicted to increase from USD 48.54 billion in 2025 to approximately USD 113.29 billion by ...

(MENAFN- Asia Times) Advanced IC packaging is a hot new source of competition among manufacturers of AI processors and other advanced integrated circuits (ICs), and emerging as the next front in the ...

Another common challenge is the time required for verification signoff prior to manufacture. The proven way to avoid this bottleneck and its related impacts is to implement a process and methodology ...

Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...

Innolux will remodel a 3.5G LCD panel factory to house an IC packaging line, with production to begin in second-half 2023, according to company president James Yang. Innolux has been developing FO-PLP ...

NEW YORK, Sept. 16, 2021 /PRNewswire/ -- Zion Market Research has published a new report titled "Semiconductor and IC Packaging Material Market By Type (Lead Frames, Bonding Wires, Ceramic Packages, ...

According to projections from Towards Packaging, the global semiconductor and IC packaging materials market is set to increase from USD 53.48 billion in 2026 to nearly USD 114.28 billion by 2034, ...

CHICAGO, March 25, 2024 /PRNewswire/ -- The report "Semiconductor & IC Packaging Materials Market by Type (Organic substrate, Bonding wires, Leadframes, Encapsulation resins, Ceramic packages, Die ...