PITTSBURGH, Oct. 17, 2019 /PRNewswire/-- Samsung Foundry certified ANSYS (NASDAQ: ANSS) multiphysics simulation solutions for its latest multi-die integration TM (MDI ...

Through Ansys Channel Partner ecosystem, advanced engineering simulation and electronic design solutions will be rapidly deployed across Kaynes Semicon’s operations ...

Ansys Redhawk-SC™ and Ansys Redhawk-SC Electrothermal™ have been certified by United Microelectronics Corporation (UMC) to simulate its latest 3D integrated circuit (3D-IC) packaging technology Chip ...

Kaynes Semicon, the semiconductor assembly and test arm of Kaynes Technology India Ltd., has adopted engineering simulation ...

SUNNYVALE, Calif.--(BUSINESS WIRE)-- Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced the launch of IDE 2.0, a ...

Great Lakes Semiconductor (GLS) and Advanced Printed Electronic Solutions (APES) have entered a strategic partnership to launch a new initiative focused on advanced semiconductor packaging and ...

MINNEAPOLIS--(BUSINESS WIRE)--CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will unveil the new ...

Expands Advanced Packaging Platform Across Wafer-Level and Panel-Level Applications in Key Global Markets-FREMONT, Calif., Feb. 26, 2026 ...

The high power consumption of electronic systems, driven by applications in Artificial Intelligence (AI) and High-Performance Computing (HPC), is generating a significant demand to address overheating ...

TEMPE, Ariz.--(BUSINESS WIRE)-- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces ...