Through Ansys Channel Partner ecosystem, advanced engineering simulation and electronic design solutions will be rapidly deployed across Kaynes Semicon’s operations ...

Great Lakes Semiconductor (GLS) and Advanced Printed Electronic Solutions (APES) have entered a strategic partnership to launch a new initiative focused on advanced semiconductor packaging and ...

Summary: Our AI Investor Podcast hosts, Eric Bleeker and Austin Smith, have been counting down 12 trends they believe AI investors will want to keep an eye on in 2026. Recently, the two discussed an ...

Expands Advanced Packaging Platform Across Wafer-Level and Panel-Level Applications in Key Global Markets-FREMONT, Calif., Feb. 26, 2026 ...

The company received additional orders in 3Di metrology, including from an OEM for panel level process development, and sees growth in panel-level packaging as a trend for enterprise server and AI ...

As Intel, Samsung Electronics, and TSMC increase investment in advanced packaging, market sources say SMIC has set up an advanced packaging research organization in Shanghai, with SMIC chairman Liu ...

Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding held its earnings call, revealing that robust demand for advanced semiconductor packaging services drove growth ...

TAIPEI, Feb 5 (Reuters) - ASE Technology Holding (3711.TW), opens new tab, the world's largest chip packaging and testing provider, said on Thursday that it expects its advanced packaging business to ...

The site of TSMC's planned advanced packaging base in southern Taiwan has cleared its environmental impact assessment, allowing the project to move forward. Two plants are under construction, with ...

Samsung Electronics Co. Ltd. (OTC: SSNLF) is accelerating investment in advanced semiconductor manufacturing to capture rising global demand for high-performance chips, particularly from artificial ...

Advanced Micro Devices was hit with a patent infringement lawsuit on Nov. 3 in Texas Western District Court over its semiconductor bonding technology. The action, brought by Alston & Bird, Alston & ...

Joseph Tung stated, "For ATM, as Tien mentioned, we expect 2026 leading-edge revenue to at least double compared with last year, while demand continues to significantly exceed supply." Tung added, "We ...