Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

The semiconductor industry is shifting at 2nm from transistor scaling to chiplet-based architectures and advanced packaging. Performance gains are increasingly driven by heterogeneous integration ...

The pace of innovation in advanced packaging is rewriting the rules that IC and package teams have relied on for decades.

Advanced Micro Devices was hit with a patent infringement lawsuit on Nov. 3 in Texas Western District Court over its semiconductor bonding technology. The action, brought by Alston & Bird, Alston & ...

Abstract: With the progressive limitations of Moore's Law, the semiconductor industry is increasingly transitioning toward advanced packaging technologies. Among these, chiplet-based architectures ...

Samsung Electronics Co. Ltd. (OTC: SSNLF) is accelerating investment in advanced semiconductor manufacturing to capture rising global demand for high-performance chips, particularly from artificial ...

HANOI, Vietnam, Jan. 29, 2026 /PRNewswire/ --On January 28, 2026, in Hanoi, FPT Corporation officially announced the establishment of the FPT Advanced Semiconductor Testing and Packaging Plant, aiming ...

Lam Research’s conference call begin in a few minutes. You can register to join here. Overall, Lam Research is estimating the wafer fabrication equipment industry will grow from $110 billion to $135 ...

From left: Arno Eichberger (Institute of Automotive Engineering at Graz University of Technology), Martin Peter (Vice President Magna Vehicle Engineering), Graz University of Technology Rector Horst ...

WENZHOU, ZHEJIANG PROVINCE, CHINA, January 19, 2026 /EINPresswire.com/ — As the global pharmaceutical and healthcare industries continue to expand at an ...

MOUNTAIN VIEW, Calif.--(BUSINESS WIRE)--Diamond Quanta today announced Adamantine Thermal™, an engineered-diamond thermal platform designed for integration into advanced packaging workflows and ...